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| HZK-L Series Silicon Epitaxial Planar Zener Diodes for Stabilized Power Supply REJ03G0019-0300Z (Previous: ADE-208-127B) Rev.3.00 May.14.2003 Features * Low leakage, low zener impedance and maximum power dissipation of 400 mW. * Wide spectrum from 5.2V through 38V of zener voltage provide flexible application. * LLD package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HZK-L Series Mark Color Code Package Code LLD Pin Arrangement Cathode band 1 3rd. band 2nd. band Cathode band 1 3rd. band 2nd. band 2 2 1. Cathode 2. Anode Rev.3.00, May.14.2003, page 1 of 6 HZK-L Series Absolute Maximum Ratings (Ta = 25C) Item Power dissipation Junction temperature Storage temperature Note: With P.C. Board. Symbol Pd * Tj Tstg Value 400 175 -55 to +175 Unit mW C C Electrical Characteristics (Ta = 25C) Zener Voltage VZ (V)* Type HZK6L Grade A B C HZK7L A B C HZK9L A B C HZK11L A B C HZK12L A B C HZK15L HZK16L HZK18L HZK20L HZK22L HZK24L HZK27L Min 5.2 5.5 5.8 6.3 6.7 7.2 7.7 8.3 8.9 9.5 10.2 10.9 11.6 12.4 13.2 14.1 15.3 16.9 18.8 20.9 22.9 25.2 Max 5.7 6.0 6.4 6.9 7.3 7.9 8.5 9.1 9.7 10.3 11.1 11.9 12.7 13.4 14.3 15.5 17.1 19.0 21.1 23.3 25.5 28.6 0.5 0.5 0.5 0.5 0.5 0.5 0.5 1 1 1 1 1 1 1 13.0 14.0 15.0 18.0 20.0 22.0 24.0 80 80 80 100 100 120 150 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 1 10.5 80 0.5 0.5 1 8.0 80 0.5 0.5 1 6.0 60 0.5 0.5 1 3.5 Test Condition IZ (mA) 0.5 Reverse Current IR (A) Max 1 Test Condition VR (V) 2.0 Dynamic Resistance rd () Max 150 80 60 60 0.5 Test Condition IZ (mA) 0.5 Note: Tested with DC. Type No. is as follows: HZK6AL, HZK6BL, *** HZK36L. Rev.3.00, May.14.2003, page 2 of 6 HZK-L Series Electrical Characteristics (cont.) Zener Voltage VZ (V)* Type HZK30L HZK33L HZK36L Grade Min 28.2 31.2 34.2 Max 31.6 34.6 38.0 Test Condition IZ (mA) 0.5 0.5 0.5 Reverse Current IR (A) Max 1 1 1 Test Condition VR (V) 27.0 30.0 33.0 Dynamic Resistance rd () Max 200 250 300 Test Condition IZ (mA) 0.5 0.5 0.5 Note: Tested with DC. Type No. is as follows: HZK6AL, HZK6BL, *** HZK36L. Mark Color Code Type HZK6AL HZK6BL HZK6CL HZK7AL HZK7BL HZK7CL HZK9AL HZK9BL HZK9CL HZK11AL HZK11BL HZK11CL HZK12AL HZK12BL HZK12CL HZK15L HZK16L HZK18L HZK20L HZK22L HZK24L HZK27L HZK30L HZK33L HZK36L HZK30L HZK33L HZK36L Cathode Band Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Orange Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Yellow Second Band Verdure Verdure Verdure Yellow Green Yellow Green Yellow Green Purple Purple Purple Light Blue Light Blue Light Blue White White White Black Yellor Ocher Pink Orange Yellow Verdure Yellow Green Purple Light Blue White Purple Light Blue White Third Band Pink Verdure Light Blue Pink Verdure Light Blue Pink Verdure Light Blue Pink Verdure Light Blue Pink Verdure Light Blue Pink Pink Pink Pink Pink Pink Pink Pink Pink Pink Pink Pink Pink Rev.3.00, May.14.2003, page 3 of 6 HZK-L Series Main Characteristic HZK7L 10-2 HZK16L HZK24L HZK11L HZK12L HZK15L HZK18L HZK20L HZK22L HZK27L HZK30L HZK33L Zener Current IZ (A) 10-4 10-5 10-6 0 5 10 15 20 25 30 HZK36L 10-3 HZK6L HZK9L 35 40 Zener Voltage VZ (V) Fig.1 Zener current vs. Zener voltage Zener Voltage Temperature Coefficient Z (mV/C) Zener Voltage Temperature Coefficient Z (%/C) 0.10 0.08 0.06 0.04 0.02 0 -0.02 -0.04 -0.06 -0.08 -0.10 0 5 mV/C %/C 50 40 30 20 10 0 -10 -20 -30 -40 -50 10 15 20 25 30 35 40 Zener Voltage VZ (V) 500 2.5mm 3mm Power Dissipation Pd (mW) 400 Printed circuit board 15 x 20 x 1.6t mm Material: Glass epoxy 300 200 100 0 0 50 100 150 200 Ambient Temperature Ta (C) Fig.3 Power Dissipation vs. Ambient Temperature Fig.2 Temperature Coefficient vs. Zener voltage Rev.3.00, May.14.2003, page 4 of 6 HZK-L Series Package Dimensions As of January, 2003 Unit: mm 3.5 +0.1 -0.2 1.35 0.1* (0.35 Typ) Package Code JEDEC JEITA Mass (reference value) LLD -- -- 0.027 g * HSK122: 1.4 0.1 type Rev.3.00, May.14.2003, page 5 of 6 HZK-L Series Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. http://www.renesas.com Copyright (c) 2003. Renesas Technology Corporation, All rights reserved. Printed in Japan. Colophon 0.0 Rev.3.00, May.14.2003, page 6 of 6 |
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